State of the Future • 12 implied HN points • 10 Mar 26
- Flexible thin‑film IGZO chips let you add cheap, bendable compute to everyday objects that never had it, creating a new class of semiconductor separate from cutting‑edge silicon.
- Process times measured in days and a tiny, modular 20Ă—30m fab footprint make manufacturing much cheaper and faster, enabling billions of units and even the possibility of deploying fabs at customer sites.
- Edge intelligence can be very simple but valuable: tiny classifiers of a few hundred gates plus basic sensors can capture huge amounts of real‑world data for use in supply chains, healthcare, and agriculture, shifting value to the aggregate data layer.