SemiAnalysis • 7677 implied HN points • 09 Feb 24
- Hybrid bonding is a major innovation in semiconductor manufacturing, impacting design processes and supply chains.
- There are engineering challenges in bringing hybrid bonding to high volume production, with a focus on cleanliness, surface smoothness, and alignment accuracy.
- Wafers are bonded using advanced techniques such as wafer-to-wafer or die-to-wafer processes based on alignment accuracy, throughput, and bond yields.