Mule’s Musings • 263 implied HN points • 15 Jun 23
- VLSI Japan discussed the revolutionary Backside Power Delivery (BSPDN) technology and its importance in semiconductor design.
- BSPDN addresses the IR droop problem in semiconductor design, offering power and performance benefits like decreased IR droop and increased core performance.
- Intel's adoption of PowerVia technology positions them ahead of competitors like TSMC, providing potential competitive advantages in process efficiency and cost.